Daniel Radford (’11) was born in Salt Lake City and raised in Hanford, California. After serving an LDS mission in New York City, he moved to Saint George, where he began attending Utah Tech University in 2007. While at Utah Tech, Daniel met and married Tycee DeMille, a Saint George native. Daniel and Tycee are currently the proud parents of two beautiful daughters’ ages three and one.
Daniel fell in love with Saint George and its people. In 2011 he graduated from Utah Tech with his bachelor’s degree in business administration with an emphasis in finance. Daniel then took a year off from school and taught sign language courses for Utah Tech University and was heavily involved in the deaf community.
After taking a year off from his studies, Daniel decided to attend law school in San Diego, California. He finished in the top of his class. After completing his first year of law school he elected to transfer closer to home by finishing law school at the University of Utah’s College of Law. While in law school, Daniel was involved in an automobile accident which helped him to develop a deep passion for helping those who become injured. In the summer of 2014, Daniel accepted a position working with a preeminent local personal injury law firm named Injury Defenders. Daniel will soon begin this position upon graduation from law school in May 2015. Daniel and his family are so excited to return to Saint George after living in big cities for the last several years.
While attending Utah Tech, Daniels favorite thing was the friendships that he made. “I only took night classes, so the group of students in my program were almost always the same. We all grew to know each other really well. Some of those students I met at Utah Tech have become my best friends to this day.”
Daniel and Tycee love everything about Southern Utah and plan to raise their children here. Daniel’s pastime is playing basketball and watching his favorite team, the Utah Jazz. Daniel and Tycee love to travel, snowboard, and experience all that life has to offer.